Additional throughput, variability and precision as well as enhanced connectivity to the product flow and optimized traceability
HEITEC has recently placed two new SMD assembly systems into operation at its Eckental branch near Erlangen, thus complying with technological progress, the good business situation and, last but not least, the ability to react to customer requirements even more flexibly. Decisive criteria for the installation were more throughput, flexibility and an optimized integration into the supply chain: The two new placement machines not only nearly double the maximum assembly rate of the production line per hour, but also, the assembly of extremely small SMD components down to a size of 01005 (0.4mm x 0.2mm) is now possible, which corresponds to the ongoing trend towards miniaturization.
The innovative placement head configuration allows to handle a wide range of component sizes, and different PCB transport heights and sizes can be operated. In addition, the extremely economical line features SAP connectivity, combined with automatic material booking, which links the manufacturing process even better to the flow of goods and value creation. Features such as high-end digital camera systems, e-feeders, traceability down to component level, placement force monitoring and perfect device positioning using state-of-the-art linear motors enable optimal precision and control and reflect the latest developments in manufacturing technology.
"With this modernization of our SMD assembly lines according to the most innovative technical aspects we are very well positioned for the future," says Roland Chochoiek, Head of Electronics at HEITEC AG. "This enables us to respond even more quickly, transparently and accurately to customer requests and provide customers with the best possible basis to shorten their product launch and bring their solutions to market in a tailor-made manner."
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