Complete system for direct laser exposure
Extremely high precision and very good image results are required for the exposure of printed circuit boards. This is why Laser Direct Imaging (LDI) systems are used here, whose laser beam is focussed on a circuit board coated with lacquer, exposing it. Very high demands are placed on such systems with regard to cleanroom specifications. They must also function with the utmost precision and be extremely fail-safe. Temperature management with regard to high currents, ventilation and electromagnetic compatibility (EMC) are therefore important aspects.
Brief technical description
- Customised system solution
- HeiPac Vario subrack
- L x W x H: 370 mm x 84 HP x 6 U
- 7 slot CompactPCI ® backplane
- Windows XP operating system
- CPU board MIC
- ATX12V power supply, 300W
Axial ventilation 12VDC
Realisation
HEITEC accommodated extremely complex electronics with different architectures, bus systems, interfaces and the adaptation to high-resolution optics with a complicated lens system in a customised HeiPac Vario subrack.
HEITEC also took over the procurement of the power supply units and the fans so that the entire inner workings could be precisely harmonised. The fact that the entire system was put together from a single source meant that the most cost-effective solution could be offered. The extensive range of standardised housing modules and decades of development experience in electronics offer the opportunity to develop and manufacture a customised system solution that also meets the customer's commercial requirements. This also includes the fact that a special ventilation concept was required with regard to the specified installation of the LDI system in the target application and its use in clean room technology. Here, the cooling air is redirected in such a way that better temperature values are achieved with the high packing density and power loss, thus significantly increasing reliability and service life.
The integration level was gradually increased from level 1 (housing components) to level 4 (pre-integrated system) and all electronic assemblies were integrated into the housing, including bundling with the software. Thanks to the close, trusting cooperation with the customer, a cost-effective and customised system solution was created in a very short time.
Customer benefits
- Customised subrack for customer-specific system
- Very high reliability
- Innovative ventilation concept for optimum cooling of the electronics
- High EMC protection
- Cost-optimised solution for the customer
